Tungsten-copper, molybdenum-copper, CPC (Copper- moly copper-copper) heat sink materials combine the low thermal expansion rate of tungsten & molybdenum with the high thermal conductivity of copper, could effectively release the heat of electronic devices, and are widely used in wireless communication base stations, optical communications, vehicle IGBT, LED substrate and other fields.

Application field: Semiconductor and Electronic Technology, Photovoltaics, Aerospace and Automotive Industry, and 3C.

Xiamen Honglu can provide tungsten copper, molybdenum copper and other heat sink materials of different specifications, materials, and thermal conductivity.

W-Cu: combination of the low thermal expansion rate of tungsten and high thermal conductivity of copper. Linear expansion coefficient can be adapted according to the supporting materials. It is of superior machining performance, can produce complex shape products. To meet the different requirements of customers, we provide 6 kinds of Cu-W product series

Shape:

Sheet, shape could be customized.