WTi thin film used as diffusion barrier layer between Al and Si material for semi-conductor and PV cell industry. It is mainly obtained by physical vapor deposition (PVD) technology- magnetron sputtering the WTi target. In the semiconductor industry, tungsten films are mainly used as materials to form electronic components, such as gate electrodes or wiring materials. The requirements of integration, reliability, functionality and processing speed for these electronic components are increasing. WSi thin film is obtained from WSi sputtering targets with physical vapor deposition (PVD) technology, and WSi thin film is used in semiconductors, especially memory，such as DRAM, to act as an effective grid ohmic contact layer.

Application fields: Semiconductor, Lighting source, Aerospace, Automotive Industry

The industries look for the high-performance WTi target material, i.e. sputtering targets featuring in less particle created during the sputtering, highly uniform thin film produced and good electrical properties. Our WTI target also possess high purity and high density, which meet the requirement of diffusion barrier reliability for complex integrated circuits.

Tungsten targets produced by Xiamen Honglu is of high density and uniform structure, the thin film created possess the low electrical resistance, high heat resistance, etc., and are widely used in semiconductor electronic components and meet the needs of the industries well.

The tungsten-silicon target used in semiconductor field has very strict requirements in the aspects of purity, micro-structure control and overall quality consistency of target components, which plays a crucial role in the performance of thin films.

Shape:

W/WTi/WSi Sputtering Targets, all customized.